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manufacturer of innovative discrete semiconductor solutions
Central Semiconductor

2N2323
1.6A,50V Through-Hole SCR
2N2323 product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CPS053-CS223-2M
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
2N2323 Active 1.6A,50V Through-Hole SCR Box@500 Please call for Qty
 EAR99 8541.30.0080 Cen 2N2323 D/C 
Either
PBFREE
TIN/LEAD
CPS053-2N2323-CM Active 1.6A,50V Bare die,53.150 X 53.150 mils,SCR WafflePack@400 Please call for Qty
 EAR99 8541.30.0040  
CPS053-2N2323-CT Active 1.6A,50V Bare die,53.150 X 53.150 mils,SCR WafflePack@400 Please call for Qty
 EAR99 8541.30.0040  
CPS053-2N2323-WN Active 1.6A,50V Bare die,53.150 X 53.150 mils,SCR Wafer@3,884*</br>*Estimated, die qty will vary based on probing Please call for Qty
 EAR99 8541.30.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Header Assembly
Analytical Test Report:Header
Analytical Test Report:Bond Wire
Analytical Test Report:Pure Tin Solder
Analytical Test Report:Cap
Material Composition:TO-39
Process Change Notice:CS39-4M
Package Detail Document:TO-39
Product Reliability Data:TO-39 Package Reliability

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details &
Composition
Status
Availability

CPS053-2N2323 		1.6A,50V Bare die,53.150 X 53.150 mils,SCR
WaferForm, WafflePack
Active

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