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2N3819
8V,10mA,360mW Through-Hole JFET N Channel
2N3819 product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CP232V-2N4416A
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
2N3819 Active 8V,10mA,360mW Through-Hole JFET N Channel Box@2,500 In Stock
EAR99 8541.21.0080
CEN 
2N3 
819 
Either
PBFREE
TIN/LEAD
2N3819 APM Active 8V,10mA,360mW Through-Hole JFET N Channel Ammo@2,000 In Stock
EAR99 8541.21.0080
CEN 
2N3 
819 
Either
PBFREE
TIN/LEAD
2N3819 TRE Active 8V,10mA,360mW Through-Hole JFET N Channel Reel@2,000 Please call for Qty
EAR99 8541.21.0080
CEN 
2N3 
819 
Either
PBFREE
TIN/LEAD
CP232V-2N3819-WN Active 8V,10mA,360mW Bare die,14.000 X 14.000 mils,JFET Wafer@80,859*</br>*Estimated, die qty will vary based on probing Please call for Qty
EAR99 8541.21.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Halogen Free
Analytical Test Report:Pure Tin Solder, Sn
Analytical Test Report:Tin Plating
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Copper Bonding Wire
Analytical Test Report:Epoxy Adhesive
Analytical Test Report:Copper Wire
Product Brief:PB JFETs
Material Composition:TO-92
Process Change Notice:CP210->CP232V
Package Detail Document:TO-92
Product Reliability Data:TO-92 Package Reliability

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details
&
Composition
Status
Availability

CP232V-2N3819
8V,10mA,360mW Bare die,14.000 X 14.000 mils,JFET
WaferForm, WafflePack
Active

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