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manufacturer of innovative discrete semiconductor solutions

Through-Hole UJT
2N4870 product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
2N4870 Discontinued , Stock Only Through-Hole UJT Box@2,500 None
EAR99 8541.30.0080

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Epoxy Molding Compound
Analytical Test Report:Gold Bond Wire
Analytical Test Report:Sn Plating
Analytical Test Report:Leadframe
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Copper Bond Wire
Material Composition:TO-92
Product EOL Notice:2N4870
Product Reliability Data:TO-92 Package Reliability

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