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manufacturer of innovative discrete semiconductor solutions

2N4871
Through-Hole UJT
The image for 2N4871
is currently unavailable.

Please refer to the Device Datasheet for an image of the part case and material composition information.
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
2N4871 Discontinued , Stock Only Through-Hole UJT Box@2,500 None
EAR99 8541.30.0080
CEN 
2N4 
871 
Either
PBFREE
TIN/LEAD

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Halogen Free
Analytical Test Report:Pure Tin Solder, Sn
Analytical Test Report:Tin Plating
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Copper Bonding Wire
Analytical Test Report:Epoxy Adhesive
Analytical Test Report:Copper Wire
Spice Model:Spice Model 2N4871
Material Composition:TO-92
Package Detail Document:TO-92
Product EOL Notice:2N4870
Product Reliability Data:TO-92 Package Reliability

Alternate Devices with Different Packaging:
Datasheet
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