2N5116 :: Item Details :: 1V,4V,50mA,500mW Through-Hole JFET P Channel

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2N5116
1V,4V,50mA,500mW Through-Hole JFET P Channel

Documentation Links:

Device Datasheet

Case & Material Composition Datasheet

Item Number

Status

Description

Packaging Base

Availability

ECCN Code

HTS Code

Part Marking:

Request Samples

2N5116

Active

1V,4V,50mA,500mW Through-Hole JFET P Channel

Box@2,000

Please call for Qty

EAR99

8541.21.0080

CEN 2N5116 D/C

CP548-2N5116-CT

Discontinued

1V,4V,50mA,500mW Bare die,21.000 X 21.000 mils,JFET

WafflePack@400

In Stock

EAR99

8541.21.0040

CP548-2N5116-WN

Discontinued

1V,4V,50mA,500mW Bare die,21.000 X 21.000 mils,JFET

Wafer@12,000*</br>*Estimated, die qty will vary based on probing

In Stock

EAR99

8541.21.0040

Please note:

If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).

If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).

A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:

Analytical Test Report:Header Assembly

Analytical Test Report:Header

Analytical Test Report:Bond Wire

Analytical Test Report:Pure Tin Solder

Analytical Test Report:Cap

Spice Model:Spice Model 2N5116

Material Composition:TO-18

Package Detail Document:TO-18

Product Reliability Data:TO-18 Package Reliability

Alternate Devices with Different Packaging:

Datasheet

Part Number

Description

Packaging

Package
Details &
Composition

Status

Availability

CP548-2N5116

1V,4V,50mA,500mW Bare die,21.000 X 21.000 mils,JFET

WaferForm, WafflePack

Chip_Packaging

Discontinued, Stock Only

In stock

Click to view availability

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