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2N5459
2V,8V,10mA,310mW Through-Hole JFET N Channel
The image for 2N5459
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Please refer to the Device Datasheet for an image of the part case and material composition information.
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CP264V-2N5458
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
2N5459 Active 2V,8V,10mA,310mW Through-Hole JFET N Channel Box@2,500 Please call for Qty
EAR99 8541.21.0095
CEN 
2N5 
459 
Either
PBFREE
TIN/LEAD
CP264V-2N5459-CT Active 2V,8V,10mA,310mW Bare die,17.120 X 15.110 mils,JFET WafflePack@400 Please call for Qty
EAR99 8541.21.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Halogen Free
Analytical Test Report:Pure Tin Solder, Sn
Analytical Test Report:Tin Plating
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Copper Bonding Wire
Analytical Test Report:Epoxy Adhesive
Analytical Test Report:Lead Frame
Material Composition:TO-92
Process Change Notice:CP209->CP264V
Package Detail Document:TO-92
Product Reliability Data:TO-92 Package Reliability

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details
&
Composition
Status
Availability

CP264V-2N5459
2V,8V,10mA,310mW Bare die,17.120 X 15.110 mils,JFET
WaferForm, WafflePack
Active

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