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2N6027
40V,150mA Through-Hole Programmable UJT
2N6027 product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CP622-2N6027
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
2N6027 Active 40V,150mA Through-Hole Programmable UJT Box@2,500 In Stock
EAR99 8541.30.0080
CEN 
2N6 
027 
Either
PBFREE
TIN/LEAD
2N6027 APM Active 40V,150mA Through-Hole Programmable UJT Ammo@2,000 In Stock
EAR99 8541.30.0080
CEN 
2N6 
027 
Either
PBFREE
TIN/LEAD
2N6027 APP Active 40V,150mA Through-Hole Programmable UJT Ammo@2,000 Please call for Qty
EAR99 8541.30.0080
CEN 
2N6 
027 
Either
PBFREE
TIN/LEAD
2N6027 TRA Active 40V,150mA Through-Hole Programmable UJT Reel@2,000 In Stock
EAR99 8541.30.0080
CEN 
2N6 
027 
Either
PBFREE
TIN/LEAD
2N6027 TRB Active 40V,150mA Through-Hole Programmable UJT Reel@2,000 Please call for Qty
EAR99 8541.30.0080
CEN 
2N6 
027 
Either
PBFREE
TIN/LEAD
2N6027 TRE Active 40V,150mA Through-Hole Programmable UJT Reel@2,000 Please call for Qty
EAR99 8541.30.0080
CEN 
2N6 
027 
Either
PBFREE
TIN/LEAD
2N6027-5T Active 40V,150mA Through-Hole Programmable UJT Box@2,000 Please call for Qty
EAR99 8541.30.0080
CEN 
2N6 
027 
Either
PBFREE
TIN/LEAD
CP622-2N6027-CT Active 40V,150mA Bare die,27.560 X 27.560 mils,Programmable UJT WafflePack@400 In Stock
EAR99 8541.21.0040  
CP622-2N6027-WN Active 40V,150mA Bare die,27.560 X 27.560 mils,Programmable UJT Wafer@8,894*</br>*Estimated, die qty will vary based on probing In Stock
EAR99 8541.21.0040  
CP622-2N6027-CT20 Special Order Item 40V,150mA Bare die,27.560 X 27.560 mils,Programmable UJT WafflePack@20 Please call for Qty
EAR99 8541.21.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Epoxy Molding Compound
Analytical Test Report:Gold Bond Wire
Analytical Test Report:Sn Plating
Analytical Test Report:Leadframe
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Copper Bond Wire
Material Composition:TO-92
Product Reliability Data:TO-92 Package Reliability

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details
&
Composition
Status
Availability

CMPP6027
40V,150mA Surface mount Programmable UJT
Box, Reel
Active

CP622-2N6027
40V,150mA Bare die,27.560 X 27.560 mils,Programmable UJT
WaferForm, WafflePack
Active

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