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manufacturer of innovative discrete semiconductor solutions

BAW101
200mA,300V Surface mount Diode-Switching Dual: High Voltage: Same Polarity
BAW101 product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CMFD2004I BK Discontinued 200mA,300V Surface mount Diode-Switching Single: High Voltage Box@1,000 In Stock
Replaces BAW101 BK
EAR99 8541.10.0070 CJP 
Either
PBFREE
TIN/LEAD
CMFD2004I TR Discontinued 200mA,300V Surface mount Diode-Switching Single: High Voltage Reel@3,000 In Stock
Replaces BAW101 TR
EAR99 8541.10.0070 CJP 
Either
PBFREE
TIN/LEAD
BAW101 BK Discontinued , Stock Only 200mA,300V Surface mount Diode-Switching Dual: High Voltage: Same Polarity Box@1,000 Replaced by CMFD2004I BK
Exact Mechanical Equivalent, Slight Electrical Differences
EAR99 8541.10.0070 CJP -or- BAW101 
Either
PBFREE
TIN/LEAD
BAW101 TR Discontinued , Stock Only 200mA,300V Surface mount Diode-Switching Dual: High Voltage: Same Polarity Reel@3,000 In Stock,Replaced by CMFD2004I TR
Exact Mechanical Equivalent, Slight Electrical Differences
EAR99 8541.10.0070 CJP -or- BAW101 
Either
PBFREE
TIN/LEAD

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Halogen Free
Analytical Test Report:Die Attach
Analytical Test Report:Bond Wire
Analytical Test Report:Alloy 42 leadframe
Analytical Test Report:Pure Tin Solder, Sn
Analytical Test Report:Epoxy Adhesive
Material Composition:SOT-143
Process Change Notice:BAW101 Alternate Marking
Package Detail Document:SOT-143
Product EOL Notice:BAW101
Step File 3D Object:SOT-143 (TO-253AA)

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details
&
Composition
Status
Availability

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