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BC546B
65V,100mA,500mW Through-Hole Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch
The image for BC546B
is currently unavailable.

Please refer to the Device Datasheet for an image of the part case and material composition information.
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CP388X-CMKT5089M10
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
BC546B Active 65V,100mA,500mW Through-Hole Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch Box@2,000 Please call for Qty
EAR99 8541.21.0075 BC546B 
Either
PBFREE
TIN/LEAD
BC546B APM Active 65V,100mA,500mW Through-Hole Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch Ammo@2,000 Please call for Qty
EAR99 8541.21.0075 BC546B 
Either
PBFREE
TIN/LEAD
BC546B TRE Active 65V,100mA,500mW Through-Hole Transistor-Small Signal (<=1A) NPN General Purpose Amplifier/Switch Reel@2,000 Please call for Qty
EAR99 8541.21.0075 BC546B 
Either
PBFREE
TIN/LEAD
CP388X-BC546B-CM Active 65V,100mA,500mW Bare die,12.990 X 12.990 mils,Transistor-Small Signal (<=1A) WafflePack@400 Please call for Qty
EAR99 8541.21.0040  
CP388X-BC546B-CT Active 65V,100mA,500mW Bare die,12.990 X 12.990 mils,Transistor-Small Signal (<=1A) WafflePack@400 In Stock
EAR99 8541.21.0040  
CP188-BC546B-CT Discontinued 65V,100mA,500mW Bare die,14.568 X 14.568 mils,Transistor-Small Signal (<=1A) WafflePack@400 Replaced by CP388X-BC546B-CT
Exact Electrical Equivalent, Slight Mechanical Differences
EAR99 8541.21.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Halogen Free
Analytical Test Report:Tin Plating
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Copper Bonding Wire
Analytical Test Report:Epoxy Adhesive
Analytical Test Report:Copper Wire
Analytical Test Report:Lead Frame
Material Composition:TO-92
Package Detail Document:TO-92
Product Reliability Data:TO-92 Package Reliability

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details
&
Composition
Status
Availability

CP188-BC546B
65V,100mA,500mW Bare die,14.568 X 14.568 mils,Transistor-Small Signal (<=1A)
WaferForm, WafflePack
Discontinued, Stock Only<br><a href="https://my.centralsemi.com/search/search2.php?searchtext=CP388X-BC546B">Replaced by:CP388X-BC546B</a>

None

 

CP388X-BC546B
65V,100mA,500mW Bare die,12.990 X 12.990 mils,Transistor-Small Signal (<=1A)
WaferForm, WafflePack
Active

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