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manufacturer of innovative discrete semiconductor solutions
Central Semiconductor

BZV55C22
22V,500mW Surface mount Diode-Zener Single: Standard
BZV55C22 product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CPZ28X-CMHZ4619
Chip Process Datasheet:CPZ59X-CMPZ5246B
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
BZV55C22 TR Active 22V,500mW Surface mount Diode-Zener Single: Standard Reel@2,500 In Stock
 EAR99 8541.10.0050  
Either
PBFREE
TIN/LEAD
CPZ59X-BZX55C22-CT Active Bare die,12.990 X 12.990 mils,0.5W Zener Diode WafflePack@400 Please call for Qty
 EAR99 8541.10.0040  
CPZ59X-BZX55C22-WN Active Bare die,12.990 X 12.990 mils,0.5W Zener Diode Wafer@145,998*</br>*Estimated, die qty will vary based on probing Please call for Qty
 EAR99 8541.10.0040  
CPZ19-BZX55C22-CT Discontinued Bare die,17.716 X 17.716 mils,0.5W Zener Diode WafflePack@400 In Stock,Replaced by CPZ28X-BZX55C22-CT
Exact Electrical Equivalent, Slight Mechanical Differences 		EAR99 8541.10.0040  
CPZ28X-BZX55C22-CT Limited Availability Bare die,12.990 X 12.990 mils,0.5W Zener Diode WafflePack@400 Replaced by CPZ59X-BZX55C22-CT
Exact Electrical Equivalent, Slight Mechanical Differences 		EAR99 8541.10.0040  
CPZ28X-BZX55C22-WN Limited Availability Bare die,12.990 X 12.990 mils,0.5W Zener Diode Wafer@101,184*</br>*Estimated, die qty will vary based on probing Replaced by CPZ59X-BZX55C22-WN
Exact Electrical Equivalent, Slight Mechanical Differences 		EAR99 8541.10.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Leadframe
Analytical Test Report:Sn Plating
Material Composition:SOD-80
Package Detail Document:SOD-80
Product Reliability Data:SOD-80 Package Reliability

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details &
Composition
Status
Availability

CPZ19-BZX55C22 		Bare die,17.716 X 17.716 mils,0.5W Zener Diode
WaferForm, WafflePack
Discontinued, Stock Only<br><a href="https://my.centralsemi.com/search/search2.php?searchtext=CPZ28X-BZX55C22">Replaced by:CPZ28X-BZX55C22</a>

CPZ28X-BZX55C22 		Bare die,12.990 X 12.990 mils,0.5W Zener Diode
WaferForm, WafflePack
Limited Availability<br><a href="https://my.centralsemi.com/search/search2.php?searchtext=CPZ59X-BZX55C22">Replaced by:CPZ59X-BZX55C22</a>

CPZ59X-BZX55C22 		Bare die,12.990 X 12.990 mils,0.5W Zener Diode
WaferForm, WafflePack
Active

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