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manufacturer of innovative discrete semiconductor solutions
Central Semiconductor

BZV55C3V3
3.3V,500mW Surface mount Diode-Zener Single: Standard
BZV55C3V3 product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CPZ58X-CMHZ4619
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
BZV55C3V3 TR Active 3.3V,500mW Surface mount Diode-Zener Single: Standard Reel@2,500 In Stock
 EAR99 8541.10.0050  
Either
PBFREE
TIN/LEAD
CPZ58X-BZX55C3V3-CM Active Bare die,12.990 X 12.990 mils,0.5W Zener Diode WafflePack@400 Please call for Qty
 EAR99 8541.10.0040  
CPZ58X-BZX55C3V3-CT Active Bare die,12.990 X 12.990 mils,0.5W Zener Diode WafflePack@400 Please call for Qty
 EAR99 8541.10.0040  
CPZ58X-BZX55C3V3-WN Active Bare die,12.990 X 12.990 mils,0.5W Zener Diode Wafer@142,858*</br>*Estimated, die qty will vary based on probing Please call for Qty
 EAR99 8541.10.0040  
CPZ28X-BZX55C3V3-CM Discontinued Bare die,12.990 X 12.990 mils,0.5W Zener Diode WafflePack@400 Replaced by CPZ58X-BZX55C3V3-CM
Exact Electrical Equivalent, Slight Mechanical Differences 		EAR99 8541.10.0040  
CPZ28X-BZX55C3V3-CT Discontinued Bare die,12.990 X 12.990 mils,0.5W Zener Diode WafflePack@400 Replaced by CPZ58X-BZX55C3V3-CT
Exact Electrical Equivalent, Slight Mechanical Differences 		EAR99 8541.10.0040  
CPZ28X-BZX55C3V3-WN Discontinued Bare die,12.990 X 12.990 mils,0.5W Zener Diode Wafer@101,184*</br>*Estimated, die qty will vary based on probing Replaced by CPZ58X-BZX55C3V3-WN
Exact Electrical Equivalent, Slight Mechanical Differences 		EAR99 8541.10.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Leadframe
Analytical Test Report:Sn Plating
Material Composition:SOD-80
Package Detail Document:SOD-80
Product Reliability Data:SOD-80 Package Reliability

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details &
Composition
Status
Availability

CPZ28X-BZX55C3V3 		Bare die,12.990 X 12.990 mils,0.5W Zener Diode
WaferForm, WafflePack
Discontinued, Stock Only<br><a href="https://my.centralsemi.com/search/search2.php?searchtext=CPZ58X-BZX55C3V3">Replaced by:CPZ58X-BZX55C3V3</a>

None

 

CPZ58X-BZX55C3V3 		Bare die,12.990 X 12.990 mils,0.5W Zener Diode
WaferForm, WafflePack
Active

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