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manufacturer of innovative discrete semiconductor solutions

CBRHD-06
500mA,600V Surface mount Rectifier-Bridge General Purpose
CBRHD-06 product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CPD04-CBRHD-06
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CBRHD-06 BK Active 500mA,600V Surface mount Rectifier-Bridge General Purpose Box@350 In Stock
EAR99 8541.10.0070 CBD6 
Either
PBFREE
TIN/LEAD
CBRHD-06 TR13 Active 500mA,600V Surface mount Rectifier-Bridge General Purpose Reel@3,000 In Stock
EAR99 8541.10.0070 CBD6 
Either
PBFREE
TIN/LEAD
CPD04-CBRHD-06-WN Active 500mA,600V Bare die,25.800 X 25.800 mils,Rectifier-Bridge Wafer@15,907*</br>*Estimated, die qty will vary based on probing In Stock
EAR99 8541.10.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Die Attach
Analytical Test Report:Die Attach
Analytical Test Report:Green Molding Compound
Analytical Test Report:Lead Frame
Analytical Test Report:Tin Ingot
Analytical Test Report:Epoxy Molding Compound
Analytical Test Report:Hi-Lead Solder Paste
Analytical Test Report:Pure Tin Plating
Spice Model:Spice Model CBRHD-06
Material Composition:HD DIP
Process Change Notice:HD DIP Marking code change
Process Change Notice:CPD04 Wafer Thickness Increase
Process Change Notice:CBRHD-10
Package Detail Document:HDDIP
Product Reliability Data:HDDIP Package Reliability

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details
&
Composition
Status
Availability

CPD04-CBRHD-06
500mA,600V Bare die,25.800 X 25.800 mils,Rectifier-Bridge
WaferForm, WafflePack
Active

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