You are logged in as ::  Guest      Registered user login
manufacturer of innovative discrete semiconductor solutions

CEDM7001
100mA,20V Surface mount MOSFET N-Channel Enhancement Mode
CEDM7001 product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CP361R-CEDM7001
Chip Process Datasheet:CP361X-CMUDM7001
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CEDM7001 BK Active 100mA,20V Surface mount MOSFET N-Channel Enhancement Mode Box@5,000 In Stock
EAR99 8541.21.0080
Either
PBFREE
TIN/LEAD
CEDM7001 TR Active 100mA,20V Surface mount MOSFET N-Channel Enhancement Mode Reel@8,000 In Stock
EAR99 8541.21.0080
Either
PBFREE
TIN/LEAD
CP361R-CEDM7001-CT Active 100mA,20V Bare die,14.173 X 14.173 mils,MOSFET WafflePack@400 In Stock
EAR99 8541.21.0040  
CP361R-CEDM7001-WN Active 100mA,20V Bare die,14.173 X 14.173 mils,MOSFET Wafer@123,000*</br>*Estimated, die qty will vary based on probing Please call for Qty
EAR99 8541.21.0040  
CP361X-CEDM7001-CT Active 100mA,20V Bare die,14.173 X 14.173 mils,MOSFET WafflePack@400 Please call for Qty
EAR99 8541.21.0040  
CP361X-CEDM7001-WN Active 100mA,20V Bare die,14.173 X 14.173 mils,MOSFET Wafer@119,000*</br>*Estimated, die qty will vary based on probing Please call for Qty
EAR99 8541.21.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Gold Bond Wire
Analytical Test Report:Die Attach
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Ni/Pd/Au plated leadframe
Spice Model:Spice Model CEDM7001
Material Composition:SOT-883L

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details
&
Composition
Status
Availability

CMNDM7001
100mA,20V Surface mount MOSFET N-Channel Enhancement Mode
Box, Reel
Active

CMUDM7001
100mA,20V Surface mount MOSFET N-Channel Enhancement Mode
Box, Reel
Active

CP361R-CEDM7001
100mA,20V Bare die,14.173 X 14.173 mils,MOSFET
WaferForm, WafflePack
Active

CP361X-CEDM7001
100mA,20V Bare die,14.173 X 14.173 mils,MOSFET
WaferForm, WafflePack
Active

  In order to better serve you, we have created a new web based request system.
Click here to access our new inquiry page. Login to the website is required.
First time users please use the quick and easy one time website registration.

For further assistance using the new web based request system, click here.