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CEDM7002AE
300mA,60V Surface mount MOSFET N-Channel Enhancement Mode
CEDM7002AE product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CP328R-CEDM7002AE
Chip Process Datasheet:CP328X-CMPDM7002AE
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CEDM7002AE BK Active 300mA,60V Surface mount MOSFET N-Channel Enhancement Mode Box@5,000 Please call for Qty
EAR99 8541.21.0080
Either
PBFREE
TIN/LEAD
CEDM7002AE TR Active 300mA,60V Surface mount MOSFET N-Channel Enhancement Mode Reel@8,000 In Stock
EAR99 8541.21.0080
Either
PBFREE
TIN/LEAD
CP328R-7002AE-CM Active Bare die,15.700 X 15.700 mils,N-Chan Enhancement Mode MOSFET WafflePack@400 In Stock
EAR99 8541.21.0040  
CP328R-7002AE-CT Active Bare die,15.700 X 15.700 mils,N-Chan Enhancement Mode MOSFET WafflePack@400 Please call for Qty
EAR99 8541.21.0040  
CP328R-7002AE-WN Active Bare die,15.700 X 15.700 mils,N-Chan Enhancement Mode MOSFET Wafer@95,200*</br>*Estimated, die qty will vary based on probing Please call for Qty
EAR99 8541.21.0040  
CP328X-7002AE-CM Active Bare die,15.700 X 15.700 mils,N-Chan Enhancement Mode MOSFET WafflePack@400 Please call for Qty
EAR99 8541.21.0040  
CP328X-7002AE-CT Active Bare die,15.700 X 15.700 mils,N-Chan Enhancement Mode MOSFET WafflePack@400 In Stock
EAR99 8541.21.0040  
CP328X-7002AE-WN Active Bare die,15.700 X 15.700 mils,N-Chan Enhancement Mode MOSFET Wafer@95,200*</br>*Estimated, die qty will vary based on probing Please call for Qty
EAR99 8541.21.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Gold Bond Wire
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Ni/Pd/Au plated leadframe
Spice Model:Spice Model CEDM7002AE
Material Composition:SOT-883L

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details
&
Composition
Status
Availability

CMPDM7002AE
300mA,60V Surface mount MOSFET N-Channel Enhancement Mode
Box, Reel
Active

CP328R-7002AE
Bare die,15.700 X 15.700 mils,N-Chan Enhancement Mode MOSFET
WaferForm, WafflePack
Active

CP328X-7002AE
Bare die,15.700 X 15.700 mils,N-Chan Enhancement Mode MOSFET
WaferForm, WafflePack
Active

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