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manufacturer of innovative discrete semiconductor solutions
Central Semiconductor

CEDM7004
1.78A,30V Surface mount MOSFET N-Channel Enhancement Mode
CEDM7004 product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CP394R-CEDM7004
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CEDM7004 BK Active 1.78A,30V Surface mount MOSFET N-Channel Enhancement Mode Reel@8,000 Please call for Qty
 EAR99 8541.21.0095 S 
Either
PBFREE
TIN/LEAD
CEDM7004 TR Active 1.78A,30V Surface mount MOSFET N-Channel Enhancement Mode Reel@8,000 In Stock
 EAR99 8541.21.0095 S 
Either
PBFREE
TIN/LEAD
CP394R-CEDM7004-CT Active 1.78A,30V Bare die,15.700 X 15.700 mils,MOSFET WafflePack@400 In Stock
 EAR99 8541.21.0040  
CP394R-CEDM7004-WN Active 1.78A,30V Bare die,15.700 X 15.700 mils,MOSFET Wafer@95,200*</br>*Estimated, die qty will vary based on probing Please call for Qty
 EAR99 8541.21.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Gold Bond Wire
Analytical Test Report:Die Attach
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Ni/Pd/Au plated leadframe
Spice Model:Spice Model CEDM7004
Material Composition:SOT-883L
Package Detail Document:SOT-883L

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details &
Composition
Status
Availability

CMUDM7004 		450mA,30V Surface mount MOSFET N-Channel Enhancement Mode
Box, Reel
Active

CP394R-CEDM7004 		1.78A,30V Bare die,15.700 X 15.700 mils,MOSFET
WaferForm, WafflePack
Active

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