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manufacturer of innovative discrete semiconductor solutions
Central Semiconductor

CFSH2-3L
200mA,30V Surface mount Diode-Schottky (<1A) Single
CFSH2-3L product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CPD104R-CFSH2-3L
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CFSH2-3L BK Active 200mA,30V Surface mount Diode-Schottky (<1A) Single Box@5,000 Please call for Qty
 EAR99 8541.10.0070 T 
Either
PBFREE
TIN/LEAD
CFSH2-3L TR Active 200mA,30V Surface mount Diode-Schottky (<1A) Single Reel@8,000 In Stock
 EAR99 8541.10.0070 T 
Either
PBFREE
TIN/LEAD
CPD104R-CFSH2-3L-CT Active 200mA,30V Bare die,14.567 X 14.567 mils,Diode-Schottky (<1A) WafflePack@400 In Stock
 EAR99 8541.10.0040  
CPD104R-CFSH2-3L-WN Active 200mA,30V Bare die,14.567 X 14.567 mils,Diode-Schottky (<1A) Wafer@115,325*</br>*Estimated, die qty will vary based on probing Please call for Qty
 EAR99 8541.10.0040  
CPD104R-CFSH2-3L-WR Active 200mA,30V Bare die,14.567 X 14.567 mils,Diode-Schottky (<1A) Wafer@115,325*</br>*Estimated, die qty will vary based on probing Please call for Qty
 EAR99 8541.10.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Gold Bond Wire
Analytical Test Report:Die Attach
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Ni/Pd/Au plated leadframe
Spice Model:Spice Model CFSH2-3L
Material Composition:SOD-882L
Process Change Notice:CFSH01-30
Package Detail Document:SOD-882L
Product Reliability Data:SOD-882L Package Reliability

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details &
Composition
Status
Availability

CPD104R-CFSH2-3L 		200mA,30V Bare die,14.567 X 14.567 mils,Diode-Schottky (<1A)
WaferForm, WafflePack
Active

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