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CHD8-06
8A,600V Surface mount Rectifier-Hyperfast <25ns Single
CHD8-06 product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CPD19-CHD8-06
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CHD8-06 BK Active 8A,600V Surface mount Rectifier-Hyperfast <25ns Single Box@150 Please call for Qty
EAR99 8541.10.0080 CHD8-06 
Either
PBFREE
TIN/LEAD
CHD8-06 TR13 Active 8A,600V Surface mount Rectifier-Hyperfast <25ns Single Reel@2,500 In Stock
EAR99 8541.10.0080 CHD8-06 
Either
PBFREE
TIN/LEAD
CPD19-CHD8-06-CT Active 8A,600V Bare die,87.000 X 87.000 mils,Rectifier-Hyperfast <25ns WafflePack@100 In Stock
EAR99 8541.10.0040  
CPD19-CHD8-06-WN Active 8A,600V Bare die,87.000 X 87.000 mils,Rectifier-Hyperfast <25ns Wafer@1,335*</br>*Estimated, die qty will vary based on probing Please call for Qty
EAR99 8541.10.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Die Attach
Analytical Test Report:Epoxy Molding Compound
Analytical Test Report:Sn Plating
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Green Epoxy Molding Compound
Product Brief:PB HYPERFAST RECTIFIERS
Spice Model:Spice Model CHD8-06
Material Composition:DPAK
Product Reliability Data:DPAK Package Reliability

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details
&
Composition
Status
Availability

CPD19-CHD8-06
8A,600V Bare die,87.000 X 87.000 mils,Rectifier-Hyperfast <25ns
WaferForm, WafflePack
Active

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