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manufacturer of innovative discrete semiconductor solutions

CMDZ5242B
12V,250mW Surface mount Diode-Zener Single: Standard
CMDZ5242B product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CPZ28X-CMHZ4619
Chip Process Datasheet:CPZ28X-CMHZ4619
Chip Process Datasheet:CPZ58X-CMHZ4619
Chip Process Datasheet:CPZ58X-CMHZ4619
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CPZ58X-CMPZ5242B-CT Active 12V,350mW Bare die,12.990 X 12.990 mils,Diode-Zener WafflePack@400 Please call for Qty
EAR99 8541.10.0040  
CPZ58X-1N5242B-CT Active Bare die,12.990 X 12.990 mils,Diode-Zener,0.5W Zener Diode WafflePack@400 Please call for Qty
EAR99 8541.10.0040  
CMDZ5242B BK Discontinued 12V,250mW Surface mount Diode-Zener Single: Standard Box@5,000 None
EAR99 8541.10.0050 XO 
CMDZ5242B TR Discontinued 12V,250mW Surface mount Diode-Zener Single: Standard Reel@3,000 In Stock
EAR99 8541.10.0050 XO 
Either
PBFREE
TIN/LEAD
CPZ28X-CMPZ5242B-CT Limited Availability 12V,350mW Bare die,12.990 X 12.990 mils,Diode-Zener WafflePack@400 In Stock,Replaced by CPZ58X-CMPZ5242B-CT
Exact Electrical Equivalent, Slight Mechanical Differences
EAR99 8541.10.0040  
CPZ28X-1N5242B-CT Limited Availability Bare die,12.990 X 12.990 mils,Diode-Zener,0.5W Zener Diode WafflePack@400 Replaced by CPZ58X-1N5242B-CT
Exact Electrical Equivalent, Slight Mechanical Differences
EAR99 8541.10.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Halogen Epoxy Molding Compound
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Lead frame
Analytical Test Report:Sn Plating
Material Composition:SOD-323
Process Change Notice:CPZ19 REPLACED WITH CPZ28
Package Detail Document:SOD-323
Product Reliability Data:SOD-323 Package Reliability
Process Change Notice:CPZ28x ----> CPZ58X/CPZ59X
Product EOL Notice:All P/Ns in the SOD-323 case

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details
&
Composition
Status
Availability

CLL5242B
12V,500mW Surface mount Diode-Zener Single: Standard
Box, Reel
Active

CMHZ5242B
12V,500mW Surface mount Diode-Zener Single: Standard
Box, Reel
Discontinued, Stock Only

CMKZ5242B
12V,200mW Surface mount Diode-Zener Triple: Isolated
Box, Reel
Discontinued, Stock Only

None

 

CMPZ5242B
12V,350mW Surface mount Diode-Zener Single: Standard
Box, Reel
Active

CMSZ5242B
12V,275mW Surface mount Diode-Zener Single: Standard
Box, Reel
Active

CPZ28X-CMPZ5242B
12V,350mW Bare die,12.990 X 12.990 mils,Diode-Zener
WaferForm, WafflePack
Limited Availability<br><a href="https://my.centralsemi.com/search/search2.php?searchtext=CPZ58X-CMPZ5242B">Replaced by:CPZ58X-CMPZ5242B</a>

CPZ28X-1N5242B
Bare die,12.990 X 12.990 mils,Diode-Zener,0.5W Zener Diode
WaferForm, WafflePack
Limited Availability<br><a href="https://my.centralsemi.com/search/search2.php?searchtext=CPZ58X-1N5242B">Replaced by:CPZ58X-1N5242B</a>

CPZ58X-CMPZ5242B
12V,350mW Bare die,12.990 X 12.990 mils,Diode-Zener
WaferForm, WafflePack
Active

CPZ58X-1N5242B
Bare die,12.990 X 12.990 mils,Diode-Zener,0.5W Zener Diode
WaferForm, WafflePack
Active

1N5242B
Through-Hole Diode-Zener Single: Standard
Box, Reel
Active

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