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manufacturer of innovative discrete semiconductor solutions
Central Semiconductor

CMLD2004
200mA,300V Surface mount Diode-Switching Dual: High Voltage: Same Polarity
The image for CMLD2004
is currently unavailable.
Please refer to the Device Datasheet for an image of the part case and material composition information.
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CPD80V-CMPD2004S
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CPD80V-CMPD2004-WN Active 200mA,300V Bare die,16.100 X 16.100 mils,Diode-Switching Wafer@65,333*</br>*Estimated, die qty will vary based on probing Please call for Qty
 EAR99 8541.10.0040  
CMLD2004 BK Discontinued 200mA,300V Surface mount Diode-Switching Dual: High Voltage: Same Polarity Box@5,000 None
 EAR99 8541.10.0070 04D 
CMLD2004 TR Discontinued 200mA,300V Surface mount Diode-Switching Dual: High Voltage: Same Polarity Reel@3,000 None
 EAR99 8541.10.0070 04D 
CMLD2004G BK Discontinued , Stock Only 200mA,300V Surface mount Diode-Switching Dual: High Voltage: Same Polarity Box@5,000 None
 EAR99 8541.10.0070 4DG -or- DG 
Either
PBFREE
TIN/LEAD
CMLD2004G TR Discontinued , Stock Only 200mA,300V Surface mount Diode-Switching Dual: High Voltage: Same Polarity Reel@3,000 None
 EAR99 8541.10.0070 4DG -or- DG 
Either
PBFREE
TIN/LEAD

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Sn Plating
Analytical Test Report:Gold Bond Wire
Analytical Test Report:Halogen Epoxy Molding Compound
Analytical Test Report:Leadframe
Analytical Test Report:Leadframe
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Copper Bond Wire
Spice Model:I-Spice Model CMLD2004
Spice Model:P-Spice Model CMLD2004
Material Composition:SOT-563
Process Change Notice:SOT-563 Alternate Lead Frame
Process Change Notice:Copper Wire Bonding - SOT-563
Package Detail Document:SOT-563
Product Reliability Data:SOT-563 Package Reliability
Process Change Notice:SOT-563 Mechanical Outline
Product EOL Notice:SOT-563 OPTION2

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details &
Composition
Status
Availability

CMDD2004 		200mA,300V Surface mount Diode-Switching Single: High Voltage
Box, Reel
Active

CMLD2004G 		200mA,300V Surface mount Diode-Switching Dual: High Voltage: Same Polarity
Box, Reel
Discontinued, Stock Only

None

 

CMOD2004 		200mA,300V Surface mount Diode-Switching Single: High Voltage
Box, Reel
Active

CMPD2004 		200mA,300V Surface mount Diode-Switching Single: High Voltage
Box, Reel
Active

CMXD2004 		200mA,300V Surface mount Diode-Switching Triple: High Voltage
Box, Reel
Active

CPD80V-CMPD2004 		200mA,300V Bare die,16.100 X 16.100 mils,Diode-Switching
WaferForm, WafflePack
Active

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