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manufacturer of innovative discrete semiconductor solutions

CMLDM3757
Surface mount MOSFET Dual: N-Channel/P-Channel MOSFET
The image for CMLDM3757
is currently unavailable.

Please refer to the Device Datasheet for an image of the part case and material composition information.
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CMLDM3757 BK Active Surface mount MOSFET Dual: N-Channel/P-Channel MOSFET Box@5,000 Please call for Qty
EAR99 8541.21.0080 3C7 
Either
PBFREE
TIN/LEAD
CMLDM3757 TR Active Surface mount MOSFET Dual: N-Channel/P-Channel MOSFET Reel@3,000 In Stock
EAR99 8541.21.0080 3C7 
Either
PBFREE
TIN/LEAD

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Gold Bond Wire
Analytical Test Report:Halogen Epoxy Molding Compound
Analytical Test Report:Leadframe
Analytical Test Report:Leadframe
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Copper Bond Wire
Analytical Test Report:Sn Plating
Spice Model:Spice Model CMLDM3757_NCHAN
Spice Model:Spice Model CMLDM3757_PCHAN
Material Composition:SOT-563
Process Change Notice:SOT-563 Alternate Lead Frame
Process Change Notice:Copper Wire Bonding - SOT-563
Package Detail Document:SOT-563
Product Reliability Data:SOT-563 Package Reliability

Alternate Devices with Different Packaging:
Datasheet
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