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CMLDM5757
Surface mount MOSFET Dual P-Channel Enhancement Mode
The image for CMLDM5757
is currently unavailable.

Please refer to the Device Datasheet for an image of the part case and material composition information.
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CP757X-CMKDM8005
Item Number Status Packaging Base Availability Part Marking: Request Samples
CMLDM5757 BK Active Box@5,000 Please call for Qty
77C 
Either
PBFREE
TIN/LEAD
CMLDM5757 TR Active Reel@3,000 In Stock
77C 
Either
PBFREE
TIN/LEAD
CP757X-CMLDM5757-WN Active Wafer@63,845*
*Estimated, die qty will vary based on probing
Please call for Qty
 

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Gold Bond Wire
Analytical Test Report:Epoxy Molding Compound
Analytical Test Report:Leadframe
Analytical Test Report:Leadframe
Analytical Test Report:Sn Plating
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Copper Bond Wire
Spice Model:Spice Model CMLDM5757

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details
&
Composition
Status
Availability

CP757X-CMLDM5757
Chip Form: 22.000 X 17.000 P-Chan Enhancement Mode MOSFET
WaferForm, WafflePack
Active

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