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CMLDM8120
860mA,20V Surface mount MOSFET P-Channel Enhancement Mode
The image for CMLDM8120
is currently unavailable.

Please refer to the Device Datasheet for an image of the part case and material composition information.
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CP726X-CMLDM8120
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CMLDM8120G BK Active 860mA,20V Surface mount MOSFET P-Channel Enhancement Mode Box@5,000 Please call for Qty
EAR99 8541.21.0095 C8G 
Either
PBFREE
TIN/LEAD
CMLDM8120G TR Active 860mA,20V Surface mount MOSFET P-Channel Enhancement Mode Reel@3,000 Please call for Qty
EAR99 8541.21.0095 C8G 
Either
PBFREE
TIN/LEAD
CP726X-CMLDM8120-CT Active 860mA,20V Bare die,27.559 X 31.496 mils,MOSFET WafflePack@400 In Stock
EAR99 8541.21.0040  
CMLDM8120 BK Replaced by Halogen Free version 860mA,20V Surface mount MOSFET P-Channel Enhancement Mode Box@5,000 Replaced by:CMLDM8120G BK
EAR99 8541.21.0095 C81 
Either
PBFREE
TIN/LEAD
CMLDM8120 TR Replaced by Halogen Free version 860mA,20V Surface mount MOSFET P-Channel Enhancement Mode Reel@3,000 In Stock, Replaced by:CMLDM8120G TR
EAR99 8541.21.0095 C81 
Either
PBFREE
TIN/LEAD

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Halogen Epoxy Molding Compound
Analytical Test Report:Leadframe
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Copper Bond Wire
Analytical Test Report:Sn Plating
Spice Model:Spice Model CMLDM8120
Material Composition:SOT-563
Process Change Notice:SMD MOSFET Halogen Free Mold
Process Change Notice:SOT-563 Alternate Lead Frame
Process Change Notice:Copper Wire Bonding - SOT-563
Package Detail Document:SOT-563
Product Reliability Data:SOT-563 Package Reliability

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details
&
Composition
Status
Availability

CMLDM8120G
860mA,20V Surface mount MOSFET P-Channel Enhancement Mode
Box, Reel
Active

CMPDM8120
860mA,20V Surface mount MOSFET P-Channel Enhancement Mode
Box, Reel
Active

CP726X-CMLDM8120
860mA,20V Bare die,27.559 X 31.496 mils,MOSFET
WaferForm, WafflePack
Active

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