You are logged in as ::  Guest      Registered user login
manufacturer of innovative discrete semiconductor solutions

CMPF4416A
2.5V,6V,10mA,350mW Surface mount JFET N Channel
CMPF4416A product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CP232V-2N4416A
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CMPF4416A BK Active 2.5V,6V,10mA,350mW Surface mount JFET N Channel Box@3,500 Please call for Qty
EAR99 8541.21.0080 6BG 
Either
PBFREE
TIN/LEAD
CMPF4416A TR Active 2.5V,6V,10mA,350mW Surface mount JFET N Channel Reel@3,000 In Stock
EAR99 8541.21.0080 6BG 
Either
PBFREE
TIN/LEAD
CP232V-2N4416A-CM Active 2.5V,6V,10mA,300mW Bare die,14.000 X 14.000 mils,JFET WafflePack@400 Please call for Qty
EAR99 8541.21.0040  
CP232V-2N4416A-CT Active 2.5V,6V,10mA,300mW Bare die,14.000 X 14.000 mils,JFET WafflePack@400 In Stock
EAR99 8541.21.0040  
CP232V-2N4416A-WN Active 2.5V,6V,10mA,300mW Bare die,14.000 X 14.000 mils,JFET Wafer@80,859*</br>*Estimated, die qty will vary based on probing Please call for Qty
EAR99 8541.21.0040  
CP210-2N4416A-CT Discontinued 2.5V,6V,10mA,300mW Bare die,15.000 X 15.000 mils,JFET WafflePack@400 None
EAR99 8541.21.0040  
CP210-2N4416A-CT20 Discontinued 2.5V,6V,10mA,300mW Bare die,15.000 X 15.000 mils,JFET WafflePack@20 None
EAR99 8541.21.0040  
CP210-2N4416A-WN Discontinued 2.5V,6V,10mA,300mW Bare die,15.000 X 15.000 mils,JFET Wafer@72,000*</br>*Estimated, die qty will vary based on probing None
EAR99 8541.21.0040  
CP232V-2N4416A-CT20 Special Order Item 2.5V,6V,10mA,300mW Bare die,14.000 X 14.000 mils,JFET WafflePack@20 Please call for Qty
EAR99 8541.21.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Leadframe
Analytical Test Report:Gold Bond Wire
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Sn Plating
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Copper Bond Wire
Product Brief:PB JFETs
Spice Model:Spice Model CMPF4416A
Material Composition:SOT-23
Process Change Notice:Copper Wire Bonding
Process Change Notice:CP210->CP232V
Package Detail Document:SOT-23
Product Reliability Data:SOT-23 Package Reliability
Step File 3D Object:SOT-23

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details
&
Composition
Status
Availability

CP210-2N4416A
2.5V,6V,10mA,300mW Bare die,15.000 X 15.000 mils,JFET
WaferForm, WafflePack
Discontinued, Stock Only

None

 

CP232V-2N4416A
2.5V,6V,10mA,300mW Bare die,14.000 X 14.000 mils,JFET
WaferForm, WafflePack
Active

2N4416A
2.5V,6V,10mA,300mW Through-Hole JFET N Channel
Box
Active

  In order to better serve you, we have created a new web based request system.
Click here to access our new inquiry page. Login to the website is required.
First time users please use the quick and easy one time website registration.

For further assistance using the new web based request system, click here.