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CMPFJ176
Surface mount JFET P Channel
CMPFJ176 product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CP613V-J175
Item Number Status Packaging Base Availability Part Marking: Request Samples
CMPFJ176 BK Active Box@3,500 Please call for Qty
6X 
Either
PBFREE
TIN/LEAD
CMPFJ176 TR Active Reel@3,000 In Stock
6X 
Either
PBFREE
TIN/LEAD
CP613V-J176-WN Active Wafer@27,725*
*Estimated, die qty will vary based on probing
Please call for Qty
 

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Alloy 42 leadframe
Analytical Test Report:Gold Bond Wire
Analytical Test Report:Epoxy Molding Compound
Analytical Test Report:Sn Plating
Analytical Test Report:Epoxy Molding Compound
Analytical Test Report:Leadframe
Analytical Test Report:Gold Bond Wire
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Sn Plating
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Copper Bond Wire
Material Composition:SOT-23

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details
&
Composition
Status
Availability

CP613V-J176
Chip Form: 24.000 X 21.000 P-Channel Amplifier JFET
WaferForm, WafflePack
Active

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