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CMPT918
15V,50mA,350mW Surface mount Transistor-Small Signal (<=1A) NPN RF Oscillator
CMPT918 product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CP317X-CMPT5179
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CMPT918 BK Active 15V,50mA,350mW Surface mount Transistor-Small Signal (<=1A) NPN RF Oscillator Box@3,500 In Stock
EAR99 8541.21.0080 C3B 
Either
PBFREE
TIN/LEAD
CMPT918 TR Active 15V,50mA,350mW Surface mount Transistor-Small Signal (<=1A) NPN RF Oscillator Reel@3,000 In Stock
EAR99 8541.21.0080 C3B 
Either
PBFREE
TIN/LEAD
CP317X-2N918-CM Active 15V,50mA,200mW Bare die,14.565 X 14.565 mils,Transistor-Small Signal (<=1A) WafflePack@400 Please call for Qty
EAR99 8541.21.0040  
CP317X-2N918-CT Active 15V,50mA,200mW Bare die,14.565 X 14.565 mils,Transistor-Small Signal (<=1A) WafflePack@400 In Stock
EAR99 8541.21.0040  
CP317X-2N918-WN Active 15V,50mA,200mW Bare die,14.565 X 14.565 mils,Transistor-Small Signal (<=1A) Wafer@81,751*</br>*Estimated, die qty will vary based on probing Please call for Qty
EAR99 8541.21.0040  
CP317-2N918-CT Discontinued 15V,50mA,200mW Bare die,14.565 X 14.565 mils,Transistor-Small Signal (<=1A) WafflePack@400 None
EAR99 8541.21.0040  
CP317X-2N918-CT20 Special Order Item 15V,50mA,200mW Bare die,14.565 X 14.565 mils,Transistor-Small Signal (<=1A) WafflePack@20 In Stock
EAR99 8541.21.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Leadframe
Analytical Test Report:Gold Bond Wire
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Sn Plating
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Copper Bond Wire
Analytical Test Report:Henkel 84-1LMISR4
Spice Model:Spice Model CMPT918
Material Composition:SOT-23
Process Change Notice:Copper Wire Bonding
Package Detail Document:SOT-23
Product Reliability Data:SOT-23 Package Reliability
Process Change Notice:CMPT5179 / CMPT918 / CEN1056A

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details
&
Composition
Status
Availability

CP317-2N918
15V,50mA,200mW Bare die,14.565 X 14.565 mils,Transistor-Small Signal (<=1A)
WaferForm, WafflePack
Discontinued, Stock Only

None

 

CP317X-2N918
15V,50mA,200mW Bare die,14.565 X 14.565 mils,Transistor-Small Signal (<=1A)
WaferForm, WafflePack
Active

PN918
15V,50mA,625mW Through-Hole Transistor-Small Signal (<=1A) NPN RF Oscillator
Box, Ammo, Reel
Active

2N918
15V,50mA,200mW Through-Hole Transistor-Small Signal (<=1A) NPN RF Oscillator
Box
Active

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