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manufacturer of innovative discrete semiconductor solutions
Central Semiconductor

CMR1-06M
1A,600V Surface mount Rectifier-General Purpose Single
CMR1-06M product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CPD05-CXR1-04
Chip Process Datasheet:CPD69-CZR1-04C
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CMR1-06M BK Active 1A,600V Surface mount Rectifier-General Purpose Single Box@800 Please call for Qty
 EAR99 8541.10.0080 C06M 
Either
PBFREE
TIN/LEAD
CMR1-06M TR13 Active 1A,600V Surface mount Rectifier-General Purpose Single Reel@5,000 In Stock
 EAR99 8541.10.0080 C06M 
Either
PBFREE
TIN/LEAD
CPD69-CMR1-06M-CT Active 1A,600V Bare die,42.500 X 42.500 mils,Rectifier-General Purpose WafflePack@400 Please call for Qty
 EAR99 8541.10.0040  
CPD69-CMR1-06M-WN Active 1A,600V Bare die,42.500 X 42.500 mils,Rectifier-General Purpose Wafer@5,915*</br>*Estimated, die qty will vary based on probing Please call for Qty
 EAR99 8541.10.0040  
CPD05-CMR1-06M-WN Discontinued, Stock Only 1A,600V Bare die,51.147 X 51.147 mils,Rectifier-General Purpose Wafer@4,250*</br>*Estimated, die qty will vary based on probing Replaced by CPD69-CMR1-06M-WN
Exact Electrical Equivalent, Slight Mechanical Differences 		EAR99 8541.10.0040  
CPD69-CMR1-06M-CT20 Special Order Item 1A,600V Bare die,42.500 X 42.500 mils,Rectifier-General Purpose WafflePack@20 Please call for Qty
 EAR99 8541.10.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Die Attach
Analytical Test Report:Leadframe
Analytical Test Report:Sn Plating
Analytical Test Report:Die Attach
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Tin Ingot
Analytical Test Report:Epoxy Molding Compound
Analytical Test Report:Hi-Lead Solder Paste
Analytical Test Report:Lead Frame
Analytical Test Report:Lead frame
Analytical Test Report:Solder
Analytical Test Report:Molding Compound
Analytical Test Report:Plating
Analytical Test Report:Die
Spice Model:Spice Model CMR1-06M
Material Composition:SMA
Process Change Notice:SMA, SMB, DIP, SMDIP general
Process Change Notice:SMA CASE
Package Detail Document:SMA TR13
Product Reliability Data:SMA Package Reliability
Process Change Notice:SMA GP RECTIFIERS

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details &
Composition
Status
Availability

CPD05-CMR1-06M 		1A,600V Bare die,51.147 X 51.147 mils,Rectifier-General Purpose
WaferForm, WafflePack
Discontinued, Stock Only<br><a href="https://my.centralsemi.com/search/search2.php?searchtext=CPD69-CMR1-06M">Replaced by:CPD69-CMR1-06M</a>

None

 

CPD69-CMR1-06M 		1A,600V Bare die,42.500 X 42.500 mils,Rectifier-General Purpose
WaferForm, WafflePack
Active

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