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manufacturer of innovative discrete semiconductor solutions
Central Semiconductor

CMSSH-3
30V Surface mount Diode-Schottky (<1A) Single
CMSSH-3 product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CPD48V-CMOSH-3
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CMSSH-3 BK Active 30V Surface mount Diode-Schottky (<1A) Single Box@5,000 Please call for Qty
 EAR99 8541.10.0070 95D 
Either
PBFREE
TIN/LEAD
CMSSH-3 TR Active 30V Surface mount Diode-Schottky (<1A) Single Reel@3,000 In Stock
 EAR99 8541.10.0070 95D 
Either
PBFREE
TIN/LEAD
CPD48V-CMPSH-3-CT Active 30V Bare die,13.777 X 13.777 mils,Rectifier-Schottky (>=1A) WafflePack@400 Please call for Qty
 EAR99 8541.10.0040  
CPD48V-CMPSH-3-WN Active 30V Bare die,13.777 X 13.777 mils,Rectifier-Schottky (>=1A) Wafer@128,840*</br>*Estimated, die qty will vary based on probing Please call for Qty
 EAR99 8541.10.0040  
CPD35-CMPSH-3-WN Discontinued Bare die,15.500 X 15.500 mils,0.2A, 30V Schottky Diode Wafer@41,000*</br>*Estimated, die qty will vary based on probing In Stock,Replaced by CPD48V-CMPSH-3-WN
Exact Electrical Equivalent, Slight Mechanical Differences 		EAR99 8541.10.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Gold Bond Wire
Analytical Test Report:Halogen Epoxy Molding Compound
Analytical Test Report:Leadframe
Analytical Test Report:Leadframe
Analytical Test Report:Gold Bond Wire
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Sn Plating
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Molding Compound
Analytical Test Report:Wire
Analytical Test Report:Sn Plating
Spice Model:Spice Model CMSSH-3
Material Composition:SOT-323
Process Change Notice:Copper Wire Bonding
Process Change Notice:Tin Wafer Backside Metal
Package Detail Document:SOT-323
Product Reliability Data:SOT-323 Package Reliability
Step File 3D Object:SOT-323 (SC-70)

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details &
Composition
Status
Availability

CMDSH-3 		100mA,30V Surface mount Diode-Schottky (<1A) Single
Box, Reel
Active

CMDSH-3G 		100mA,30V Surface mount Diode-Schottky (<1A) Single
Box, Reel
Replaced by Halogen Free Version:CMDSH-3

CMHSH-3 		30V Surface mount Diode-Schottky (<1A) Single
Box, Reel
Active

CMOSH-3 		30V Surface mount Diode-Schottky (<1A) Single
Box, Reel
Active

CMPSH-3 		30V Surface mount Diode-Schottky (<1A) Single
Box, Reel
Active

CMXSH-3 		30V Surface mount Diode-Schottky (<1A) Triple
Box, Reel
Active

CPD35-CMPSH-3 		Bare die,15.500 X 15.500 mils,0.2A, 30V Schottky Diode
WaferForm, WafflePack
Discontinued, Stock Only<br><a href="https://my.centralsemi.com/search/search2.php?searchtext=CPD48V-CMPSH-3">Replaced by:CPD48V-CMPSH-3</a>

CPD48V-CMPSH-3 		30V Bare die,13.777 X 13.777 mils,Rectifier-Schottky (>=1A)
WaferForm, WafflePack
Active

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