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manufacturer of innovative discrete semiconductor solutions
Central Semiconductor

CMST3410
25V,1A,275mW Surface mount Transistor-Small Signal (<=1A) NPN Low VCE(SAT)
CMST3410 product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CP341V-CMLT3474
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CMST3410 BK Active 25V,1A,275mW Surface mount Transistor-Small Signal (<=1A) NPN Low VCE(SAT) Box@5,000 Please call for Qty
 EAR99 8541.21.0075 C03 
Either
PBFREE
TIN/LEAD
CMST3410 TR Active 25V,1A,275mW Surface mount Transistor-Small Signal (<=1A) NPN Low VCE(SAT) Reel@3,000 In Stock
 EAR99 8541.21.0075 C03 
Either
PBFREE
TIN/LEAD
CP341V-CMPT3410-CM Active 25V,1A,350mW Bare die,17.720 X 17.720 mils,Transistor-Small Signal (<=1A) WafflePack@400 Please call for Qty
 EAR99 8541.21.0040  
CP341V-CMPT3410-CT Active 25V,1A,350mW Bare die,17.720 X 17.720 mils,Transistor-Small Signal (<=1A) WafflePack@400 In Stock
 EAR99 8541.21.0040  
CP341V-CMPT3410-WN Active 25V,1A,350mW Bare die,17.720 X 17.720 mils,Transistor-Small Signal (<=1A) Wafer@76,280*</br>*Estimated, die qty will vary based on probing Please call for Qty
 EAR99 8541.21.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Gold Bond Wire
Analytical Test Report:Halogen Epoxy Molding Compound
Analytical Test Report:Leadframe
Analytical Test Report:Leadframe
Analytical Test Report:Gold Bond Wire
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Sn Plating
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Molding Compound
Analytical Test Report:Wire
Analytical Test Report:Sn Plating
Spice Model:Spice Model CMST3410
Material Composition:SOT-323
Process Change Notice:Copper Wire Bonding
Package Detail Document:SOT-323
Product Reliability Data:SOT-323 Package Reliability
Step File 3D Object:SOT-323 (SC-70)

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details &
Composition
Status
Availability

CMLT3410 		25V,1A,350mW Surface mount Transistor-Small Signal (<=1A) Dual NPN Low VCE(SAT)
Box, Reel
Active

CMPT3410 		25V,1A,350mW Surface mount Transistor-Small Signal (<=1A) NPN Low VCE(SAT)
Box, Reel
Active

CMUT3410 		25V,1A,250mW Surface mount Transistor-Small Signal (<=1A) NPN Low VCE(SAT)
Box, Reel
Active

CP341V-CMPT3410 		25V,1A,350mW Bare die,17.720 X 17.720 mils,Transistor-Small Signal (<=1A)
WaferForm, WafflePack
Active

CXT3410 		25V,1A,1.2W Surface mount Transistor-Small Signal (<=1A) NPN Low VCE(SAT)
Box, Reel
Active

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