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CPD35-CMPSH-3
Bare die,15.500 X 15.500 mils,0.2A, 30V Schottky Diode
The image for CPD35-CMPSH-3
is currently unavailable.

Please refer to the Device Datasheet for an image of the part case and material composition information.
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CPD48V-CMPSH-3-CT Active 30V Bare die,13.777 X 13.777 mils,Rectifier-Schottky (>=1A) WafflePack@400 In Stock
EAR99 8541.10.0040  
CPD48V-CMPSH-3-WN Active 30V Bare die,13.777 X 13.777 mils,Rectifier-Schottky (>=1A) Wafer@41,000*</br>*Estimated, die qty will vary based on probing Please call for Qty
Replaces CPD35-CMPSH-3-WN
EAR99 8541.10.0040  
CPD35-CMPSH-3-WN Discontinued , Stock Only Bare die,15.500 X 15.500 mils,0.2A, 30V Schottky Diode Wafer@41,000*</br>*Estimated, die qty will vary based on probing In Stock,Replaced by CPD48V-CMPSH-3-WN
Exact Electrical Equivalent, Slight Mechanical Differences
EAR99 8541.10.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Wafer Transistor
Analytical Test Report:Wafer Zener
Analytical Test Report:Wafer Schottky
Analytical Test Report:Wafer Switching Diode
Analytical Test Report:Wafer Zener
Analytical Test Report:Wafer Schottky
Analytical Test Report:Wafer Rectifier
Analytical Test Report:Wafer MOSFET
Analytical Test Report:Active Device, Rectifier
Analytical Test Report:TVS Die
Analytical Test Report:Wafer/Die
Analytical Test Report:Wafer/Die
Analytical Test Report:Die
Analytical Test Report:Die
Analytical Test Report:Die
Analytical Test Report:Die
Analytical Test Report:Die
Analytical Test Report:Die
Analytical Test Report:Die
Package Detail Document:WAFER
Product EOL Notice:BLANKET PDN-BARE DIE PRODUCTS

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details
&
Composition
Status
Availability

CMDSH-3
100mA,30V Surface mount Diode-Schottky (<1A) Single
Box, Reel
Active

CMDSH-3G
100mA,30V Surface mount Diode-Schottky (<1A) Single
Box, Reel
Replaced by Halogen Free Version:CMDSH-3

CMHSH-3
30V Surface mount Diode-Schottky (<1A) Single
Box, Reel
Active

CMOSH-3
30V Surface mount Diode-Schottky (<1A) Single
Box, Reel
Active

CMPSH-3
30V Surface mount Diode-Schottky (<1A) Single
Box, Reel
Active

CMSSH-3
30V Surface mount Diode-Schottky (<1A) Single
Box, Reel
Active

CMXSH-3
30V Surface mount Diode-Schottky (<1A) Triple
Box, Reel
Active

CPD48V-CMPSH-3
30V Bare die,13.777 X 13.777 mils,Rectifier-Schottky (>=1A)
WaferForm, WafflePack
Active

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