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manufacturer of innovative discrete semiconductor solutions
Central Semiconductor

CPS041-2N5060
.8A,30V Bare die,41.340 X 41.340 mils,SCR
The image for CPS041-2N5060
is currently unavailable.
Please refer to the Device Datasheet for an image of the part case and material composition information.
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CPS053-2N5060-CT Active .8A,30V Bare die,53.150 X 53.150 mils,SCR WafflePack@400 Please call for Qty
Replaces CPS041-2N5060-CT 		EAR99 8541.30.0040  
CPS053-2N5060-WN Active .8A,30V Bare die,53.150 X 53.150 mils,SCR Wafer@6,474*</br>*Estimated, die qty will vary based on probing Please call for Qty
 EAR99 8541.30.0040  
CPS041-2N5060-CT Discontinued , Stock Only .8A,30V Bare die,41.340 X 41.340 mils,SCR WafflePack@400 In Stock,Replaced by CPS053-2N5060-CT
Exact Electrical Equivalent, Slight Mechanical Differences 		EAR99 8541.30.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Wafer Transistor
Analytical Test Report:Wafer Schottky
Analytical Test Report:Wafer Switching Diode
Analytical Test Report:Die
Analytical Test Report:Die
Package Detail Document:WAFER
Product EOL Notice:CPS041 CHIP PROCESS

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details &
Composition
Status
Availability

CPS053-2N5060 		.8A,30V Bare die,53.150 X 53.150 mils,SCR
WaferForm, WafflePack
Active

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