CSLCDM22011-225F :: Item Details :: Up-Screened Through-Hole Assembled Device Rad Tested

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CSLCDM22011-225F
Up-Screened Through-Hole Assembled Device Rad Tested

Documentation Links:

Device Datasheet

Case & Material Composition Datasheet

Item Number

Status

Description

Packaging Base

Availability

ECCN Code

HTS Code

Part Marking:

Request Samples

CSLCDM22011-225F SL

Active

Up-Screened Through-Hole Assembled Device Rad Tested

Sleeve@50

In Stock

EAR99

8541.90.0000

CSLC11225
TO-220FP
D/C

Please note:

If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).

If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).

A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:

Analytical Test Report:Leadframe and Jump Bar

Analytical Test Report:Sn Plating

Analytical Test Report:Epoxy Molding Compound

Analytical Test Report:Plating

Analytical Test Report:Lead frame

Analytical Test Report:Die Attach

Analytical Test Report:Lead frame

Analytical Test Report:Pure Tin Plating

Product Brief:PB Spacellite-C MOSFET

Spice Model:CSLCDM22011-225F

Package Detail Document:TO-220FP

Alternate Devices with Different Packaging:
Datasheet	Part Number	Description	Packaging	Package Details & Composition	Status	Availability

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