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manufacturer of innovative discrete semiconductor solutions

CSLLDM22011-225F
Up-Screened Through-Hole Assembled Device Rad Tested
CSLLDM22011-225F product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CSLLDM22011-225F SL Active Up-Screened Through-Hole Assembled Device Rad Tested Sleeve@50 In Stock
EAR99 8541.90.0000
CSLL11225 
TO-220FP 
D/C 
Either
PBFREE
TIN/LEAD

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Leadframe and Jump Bar
Analytical Test Report:Sn Plating
Analytical Test Report:Epoxy Molding Compound
Analytical Test Report:Plating
Analytical Test Report:Lead frame
Analytical Test Report:Die Attach
Analytical Test Report:Lead frame
Analytical Test Report:Pure Tin Plating
Product Brief:PB SPACELLITE MOSFETS
Spice Model:CSLLDM22011-225F
Package Detail Document:TO-220FP

Alternate Devices with Different Packaging:
Datasheet
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