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manufacturer of innovative discrete semiconductor solutions

2N5064
.8A,200V Through-Hole SCR
2N5064 product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CPS053-CS223-2M
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
2N5064 Active .8A,200V Through-Hole SCR Box@2,500 Please call for Qty
EAR99 8541.30.0080
CEN 
2N5 
064 
Either
PBFREE
TIN/LEAD
2N5064 APM Active .8A,200V Through-Hole SCR Ammo@2,000 Please call for Qty
EAR99 8541.30.0080
CEN 
2N5 
064 
Either
PBFREE
TIN/LEAD
2N5064 TRE Active .8A,200V Through-Hole SCR Reel@2,000 Please call for Qty
EAR99 8541.30.0080
CEN 
2N5 
064 
Either
PBFREE
TIN/LEAD
2N5064-5T Active .8A,200V Through-Hole SCR Box@2,000 Please call for Qty
EAR99 8541.30.0080
CEN 
2N5 
064 
Either
PBFREE
TIN/LEAD
CPS053-2N5064-CT Active .8A,200V Bare die,53.150 X 53.150 mils,SCR WafflePack@400 Please call for Qty
EAR99 8541.30.0040  
CPS053-2N5064-WN Active .8A,200V Bare die,53.150 X 53.150 mils,SCR Wafer@3,884*</br>*Estimated, die qty will vary based on probing Please call for Qty
EAR99 8541.30.0040  
CPS041-2N5064-CT Discontinued .8A,200V Bare die,41.340 X 41.340 mils,SCR WafflePack@400 Replaced by CPS053-2N5064-CT
Exact Electrical Equivalent, Slight Mechanical Differences
EAR99 8541.30.0040  
CPS041-2N5064-WN Discontinued .8A,200V Bare die,41.340 X 41.340 mils,SCR Wafer@6,474*</br>*Estimated, die qty will vary based on probing Replaced by CPS053-2N5064-WN
Exact Electrical Equivalent, Slight Mechanical Differences
EAR99 8541.30.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Halogen Free
Analytical Test Report:Pure Tin Solder, Sn
Analytical Test Report:Tin Plating
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Copper Bonding Wire
Analytical Test Report:Epoxy Adhesive
Analytical Test Report:Copper Wire
Material Composition:TO-92
Package Detail Document:TO-92
Product Reliability Data:TO-92 Package Reliability

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details
&
Composition
Status
Availability

CPS041-2N5064
.8A,200V Bare die,41.340 X 41.340 mils,SCR
WaferForm, WafflePack
Discontinued, Stock Only<br><a href="https://my.centralsemi.com/search/search2.php?searchtext=CPS053-2N5064">Replaced by:CPS053-2N5064</a>

None

 

CPS053-2N5064
.8A,200V Bare die,53.150 X 53.150 mils,SCR
WaferForm, WafflePack
Active

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