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CPS041-2N5064
Chip Form: 41.340 X 41.340 1A, 600V SCR
The image for CPS041-2N5064
is currently unavailable.

Please refer to the Device Datasheet for an image of the part case and material composition information.
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Item Number Status Packaging Base Availability Part Marking: Request Samples
CPS053-2N5064-CT Active WafflePack@400 Please call for Qty
Replaces CPS041-2N5064-CT
 
CPS053-2N5064-WN Active Wafer@6,474*
*Estimated, die qty will vary based on probing
Please call for Qty
Replaces CPS041-2N5064-WN
 
CPS041-2N5064-CT Discontinued StockOnly WafflePack@400 Replaced by CPS053-2N5064-CT
Exact Electrical Equivalent, Slight Mechanical Differences
 
CPS041-2N5064-WN Discontinued StockOnly Wafer@6,474*
*Estimated, die qty will vary based on probing
Replaced by CPS053-2N5064-WN
Exact Electrical Equivalent, Slight Mechanical Differences
 

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Wafer Transistor
Analytical Test Report:Wafer Schottky
Analytical Test Report:Wafer Switching Diode
Analytical Test Report:Wafer Zener
Analytical Test Report:Wafer Schottky
Product EOL Notice:CPS041 CHIP PROCESS
Analytical Test Report:Wafer Zener
Analytical Test Report:Wafer MOSFET

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details
&
Composition
Status
Availability

CPS053-2N5064
Chip Form: 53.150 X 53.150 2A, 600V SCR
WaferForm, WafflePack
Active

2N5064
Through-Hole SCR
Box, Reel
Active

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