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manufacturer of innovative discrete semiconductor solutions
Central Semiconductor

BSS52
1A Through-Hole Transistor-Small Signal (<=1A) NPN Darlington
BSS52 product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CP101-BSS52
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
BSS52 Discontinued , Stock Only 1A Through-Hole Transistor-Small Signal (<=1A) NPN Darlington Box@500 None
 EAR99 8541.21.0095 Cen BSS52 D/C 
Either
PBFREE
TIN/LEAD
CP101-BSS52-CT Discontinued , Stock Only 1A Bare die,27.500 X 27.500 mils,Transistor-Small Signal (<=1A) WafflePack@400 In Stock
 EAR99 8541.21.0040  
CP101-BSS52-CT20 Discontinued , Stock Only 1A Bare die,27.500 X 27.500 mils,Transistor-Small Signal (<=1A) WafflePack@20 In Stock
 EAR99 8541.21.0040  
CP101-BSS52-WN Discontinued , Stock Only 1A Bare die,27.500 X 27.500 mils,Transistor-Small Signal (<=1A) Wafer@14,200*</br>*Estimated, die qty will vary based on probing In Stock
 EAR99 8541.21.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Header Assembly
Analytical Test Report:Header
Analytical Test Report:Pure Tin Solder
Analytical Test Report:Cap
Material Composition:TO-39
Package Detail Document:TO-39
Product EOL Notice:CP101 wafer process
Product Reliability Data:TO-39 Package Reliability

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details &
Composition
Status
Availability

CP101-BSS52 		1A Bare die,27.500 X 27.500 mils,Transistor-Small Signal (<=1A)
WaferForm, WafflePack
Discontinued, Stock Only

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