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CP101-BSS52
1A Bare die,27.500 X 27.500 mils,Transistor-Small Signal (<=1A)
The image for CP101-BSS52
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Please refer to the Device Datasheet for an image of the part case and material composition information.
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CP101-BSS52-CT Discontinued , Stock Only 1A Bare die,27.500 X 27.500 mils,Transistor-Small Signal (<=1A) WafflePack@400 In Stock
EAR99 8541.21.0040  
CP101-BSS52-CT20 Discontinued , Stock Only 1A Bare die,27.500 X 27.500 mils,Transistor-Small Signal (<=1A) WafflePack@20 In Stock
EAR99 8541.21.0040  
CP101-BSS52-WN Discontinued , Stock Only 1A Bare die,27.500 X 27.500 mils,Transistor-Small Signal (<=1A) Wafer@14,200*</br>*Estimated, die qty will vary based on probing In Stock
EAR99 8541.21.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Wafer Transistor
Analytical Test Report:Wafer Schottky
Analytical Test Report:Wafer Switching Diode
Analytical Test Report:Die
Package Detail Document:WAFER
Product EOL Notice:CP101 wafer process
Analytical Test Report:Wafer Rectifier
Analytical Test Report:Wafer
Analytical Test Report:TVS Die
Analytical Test Report:Wafer/Die
Analytical Test Report:Die

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details
&
Composition
Status
Availability

BSS52
1A Through-Hole Transistor-Small Signal (<=1A) NPN Darlington
Box
Discontinued, Stock Only

None

 

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