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manufacturer of innovative discrete semiconductor solutions

BZV55C33
33V,500mW Surface mount Diode-Zener Single: Standard
BZV55C33 product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CPZ19-CMPZ5242B
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
BZV55C33 TR Active 33V,500mW Surface mount Diode-Zener Single: Standard Reel@2,500 Please call for Qty
EAR99 8541.10.0050  
Either
PBFREE
TIN/LEAD
CPZ19-BZX55C33-CT Discontinued, Stock Only Bare die,17.716 X 17.716 mils,0.5W Zener Diode WafflePack@400 In Stock
EAR99 8541.10.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Sn Plating
Material Composition:SOD-80
Package Detail Document:SOD-80
Product Reliability Data:SOD-80 Package Reliability

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details
&
Composition
Status
Availability

CPZ19-BZX55C33
Bare die,17.716 X 17.716 mils,0.5W Zener Diode
WaferForm, WafflePack
Discontinued, Stock Only

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