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CEDM8001
Surface mount MOSFET P-Channel Enhancement Mode
CEDM8001 product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CP761R-CEDM8001
Chip Process Datasheet:CP761X-CMUDM8001
Item Number Status Packaging Base Availability Part Marking: Request Samples
CEDM8001 BK Active Box@5,000 Please call for Qty
Either
PBFREE
TIN/LEAD
CEDM8001 TR Active Reel@8,000 In Stock
Either
PBFREE
TIN/LEAD
CP761R-CEDM8001-CT Active WafflePack@400 Please call for Qty
 
CP761R-CEDM8001-WN Active Wafer@123,000*
*Estimated, die qty will vary based on probing
Please call for Qty
 
CP761X-CEDM8001-CT Active WafflePack@400 Please call for Qty
 
CP761X-CEDM8001-WN Active Wafer@123,000*
*Estimated, die qty will vary based on probing
Please call for Qty
 

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Gold Bond Wire
Analytical Test Report:Die Attach
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Ni/Pd/Au plated leadframe
Spice Model:Spice Model CEDM8001

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details
&
Composition
Status
Availability

CMNDM8001
Surface mount MOSFET P-Channel Enhancement Mode
Box, Reel
Active

CMUDM8001
Surface mount MOSFET P-Channel Enhancement Mode
Box, Reel
Active

CP761R-CEDM8001
Chip Form: P-Chan Enhancement Mode MOSFET
WaferForm, WafflePack
Active

CP761X-CEDM8001
Chip Form: P-Chan Enhancement Mode MOSFET
WaferForm, WafflePack
Active

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