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manufacturer of innovative discrete semiconductor solutions
Central Semiconductor

CMNDM8001
100mA,20V Surface mount MOSFET P-Channel Enhancement Mode
CMNDM8001 product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CP761R-CEDM8001
Chip Process Datasheet:CP761X-CMUDM8001
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CP761R-CEDM8001-CT Active 100mA,20V Bare die,14.173 X 14.173 mils,MOSFET WafflePack@400 Please call for Qty
 EAR99 8541.21.0040  
CP761R-CEDM8001-WN Active 100mA,20V Bare die,14.173 X 14.173 mils,MOSFET Wafer@123,000*</br>*Estimated, die qty will vary based on probing Please call for Qty
 EAR99 8541.21.0040  
CP761X-CEDM8001-CT Active 100mA,20V Bare die,14.173 X 14.173 mils,MOSFET WafflePack@400 Please call for Qty
 EAR99 8541.21.0040  
CP761X-CEDM8001-WN Active 100mA,20V Bare die,14.173 X 14.173 mils,MOSFET Wafer@123,000*</br>*Estimated, die qty will vary based on probing Please call for Qty
 EAR99 8541.21.0040  
CMNDM8001 BK End Of Life , LastBuy 5/21/25 100mA,20V Surface mount MOSFET P-Channel Enhancement Mode Box@5,000 None
 EAR99 8541.21.0095 BC 
Either
PBFREE
TIN/LEAD
CMNDM8001 TR End Of Life , LastBuy 5/21/25 100mA,20V Surface mount MOSFET P-Channel Enhancement Mode Reel@8,000 In Stock
 EAR99 8541.21.0095 BC 
Either
PBFREE
TIN/LEAD

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Die Attach
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Leadframe
Spice Model:Spice Model CMNDM8001
Material Composition:SOT-953
Package Detail Document:SOT-953
Product EOL Notice:Devices in the SOT-953 Case
Product Reliability Data:SOT-963 Package Reliability

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details &
Composition
Status
Availability

CEDM8001 		100mA,20V Surface mount MOSFET P-Channel Enhancement Mode
Box, Reel
Active

CMUDM8001 		100mA,20V Surface mount MOSFET P-Channel Enhancement Mode
Box, Reel
Active

CP761R-CEDM8001 		100mA,20V Bare die,14.173 X 14.173 mils,MOSFET
WaferForm, WafflePack
Active

CP761X-CEDM8001 		100mA,20V Bare die,14.173 X 14.173 mils,MOSFET
WaferForm, WafflePack
Active

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