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CMHD3595
Surface mount Diode-Low Leakage Single
CMHD3595 product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CPD66X-CMOD3003
Item Number Status Packaging Base Availability Part Marking: Request Samples
CMHD3595 BK Active Box@3,500 Please call for Qty
C95 
Either
PBFREE
TIN/LEAD
CMHD3595 TR Active Reel@3,000 In Stock
C95 
Either
PBFREE
TIN/LEAD
CPD64-1N3595-CT Discontinued WafflePack@400 Replaced by CPD66X-1N3595-CT
Exact Electrical Equivalent, Slight Mechanical Differences
 
CPD64-1N3595-WN Discontinued Wafer@34,368*
*Estimated, die qty will vary based on probing
Replaced by CPD66X-1N3595-WN
Exact Electrical Equivalent, Slight Mechanical Differences
 
CPD64-1N3595-WR Discontinued Wafer@34,368*
*Estimated, die qty will vary based on probing
Replaced by CPD66X-1N3595-WR
Exact Electrical Equivalent, Slight Mechanical Differences
 
CPD66X-1N3595-CT Limited Availability WafflePack@400 Please call for Qty
 
CPD66X-1N3595-CT20 Limited Availability WafflePack@20 Please call for Qty
 
CPD66X-1N3595-WN Limited Availability Wafer@54,848*
*Estimated, die qty will vary based on probing
Please call for Qty
 
CPD66X-1N3595-WR Limited Availability Wafer@54,848*
*Estimated, die qty will vary based on probing
Please call for Qty
 

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Epoxy Molding Compound
Analytical Test Report:Sn Plating
Analytical Test Report:Leadframe
Analytical Test Report:Gold Bond Wire
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Copper Bond Wire
Spice Model:Spice Model CMHD3595

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details
&
Composition
Status
Availability

CLL3595
Surface mount Diode-Low Leakage Single
Box, Reel
End Of Life (EOL)
Replaced by:CMHD3595

CPD64-1N3595
Chip Form: Low Leakage Switching Diode
WaferForm, WafflePack

None

 

CPD66X-1N3595
Chip Form: Low Leakage Switching Diode
WaferForm, WafflePack
Limited Availability

1N3595
Through-Hole Diode-Switching Single
Box, Reel
Active

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