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manufacturer of innovative discrete semiconductor solutions
Central Semiconductor

CPD66X-1N3595
Bare die,17.500 X 17.500 mils,Diode-Switching,Low Leakage Switching Diode
The image for CPD66X-1N3595
is currently unavailable.
Please refer to the Device Datasheet for an image of the part case and material composition information.
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CPD66X-1N3595-CM Active Bare die,17.500 X 17.500 mils,Diode-Switching,Low Leakage Switching Diode WafflePack@400 Please call for Qty
 EAR99 8541.10.0040  
CPD66X-1N3595-CT Active Bare die,17.500 X 17.500 mils,Diode-Switching,Low Leakage Switching Diode WafflePack@400 Please call for Qty
 EAR99 8541.10.0040  
CPD66X-1N3595-WN Active Bare die,17.500 X 17.500 mils,Diode-Switching,Low Leakage Switching Diode Wafer@55,461*</br>*Estimated, die qty will vary based on probing In Stock
 EAR99 8541.10.0040  
CPD66X-1N3595-WR Active Bare die,17.500 X 17.500 mils,Diode-Switching,Low Leakage Switching Diode Wafer@55,461*</br>*Estimated, die qty will vary based on probing Please call for Qty
 EAR99 8541.10.0040  
CPD66X-1N3595-CT20 Special Order Item Bare die,17.500 X 17.500 mils,Diode-Switching,Low Leakage Switching Diode WafflePack@20 Please call for Qty
 EAR99 8541.10.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Wafer Transistor
Analytical Test Report:Wafer Schottky
Analytical Test Report:Wafer Switching Diode
Analytical Test Report:Wafer Zener
Analytical Test Report:Wafer Schottky
Analytical Test Report:Active Device, Rectifier
Analytical Test Report:Wafer/Die
Analytical Test Report:Die
Analytical Test Report:Die
Analytical Test Report:Die
Analytical Test Report:Die
Analytical Test Report:Die
Spice Model:Spice Model CPD66
Package Detail Document:WAFER
Process Change Notice:CPD66X DOPANT CHANGE
Analytical Test Report:Wafer Zener
Analytical Test Report:Wafer Rectifier
Analytical Test Report:Wafer MOSFET
Analytical Test Report:TVS Die
Analytical Test Report:Wafer/Die
Analytical Test Report:Die
Analytical Test Report:Die

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details &
Composition
Status
Availability

CLL3595 		150mA,150V Surface mount Diode-Low Leakage Single
Box, Reel
Discontinued, Stock Only<br><a href="https://my.centralsemi.com/search/search2.php?searchtext=CMHD3595">Replaced by:CMHD3595</a>

None

 

CMHD3595 		150mA,150V Surface mount Diode-Low Leakage Single
Box, Reel
Active

CPD64-1N3595 		Bare die,17.500 X 17.500 mils,Diode-Switching,Low Leakage Switching Diode
WaferForm, WafflePack
Discontinued, Stock Only<br><a href="https://my.centralsemi.com/search/search2.php?searchtext=CPD66X-1N3595">Replaced by:CPD66X-1N3595</a>

None

 

1N3595 		Through-Hole Diode-Switching Single
Box, Reel
Discontinued, Stock Only

None

 

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