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manufacturer of innovative discrete semiconductor solutions

CMJD0300
100V,.31mA Surface mount Diode-Current Limiting Single
CMJD0300 product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CPL03-CMJD0300
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CMJD0300 BK Active 100V,.31mA Surface mount Diode-Current Limiting Single Box@3,500 Please call for Qty
EAR99 8541.10.0050 C301 
Either
PBFREE
TIN/LEAD
CMJD0300 TR Active 100V,.31mA Surface mount Diode-Current Limiting Single Reel@3,000 In Stock
EAR99 8541.10.0050 C301 
Either
PBFREE
TIN/LEAD
CPL03-CMJD0300-CM Active Bare die,15.700 X 15.700 mils,CLD Series WafflePack@400 In Stock
EAR99 8541.10.0040  
CPL03-CMJD0300-CT Active Bare die,15.700 X 15.700 mils,CLD Series WafflePack@400 In Stock
EAR99 8541.10.0040  
CPL03-CMJD0300-WN Active Bare die,15.700 X 15.700 mils,CLD Series Wafer@101,000*</br>*Estimated, die qty will vary based on probing Please call for Qty
EAR99 8541.10.0040  
CMJD0300 TR13 Special Order Item 100V,.31mA Surface mount Diode-Current Limiting Single Reel@10,000 Please call for Qty
EAR99 8541.10.0050 C301 
Either
PBFREE
TIN/LEAD
CPL03-CMJD0300-CT20 Special Order Item Bare die,15.700 X 15.700 mils,CLD Series WafflePack@20 In Stock
EAR99 8541.10.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Product Brief:PB CMJD SER
Spice Model:Spice Model CMJD0300
Material Composition:DFN123F
Package Detail Document:DFN123F
Product Reliability Data:DFN123F Package Reliability

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details
&
Composition
Status
Availability

CPL03-CMJD0300
Bare die,15.700 X 15.700 mils,CLD Series
WaferForm, WafflePack
Active

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