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manufacturer of innovative discrete semiconductor solutions
Central Semiconductor

CPL03-CMJD0300
Bare die,15.700 X 15.700 mils,CLD Series
The image for CPL03-CMJD0300
is currently unavailable.
Please refer to the Device Datasheet for an image of the part case and material composition information.
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CPL03-CMJD0300-CM Active Bare die,15.700 X 15.700 mils,CLD Series WafflePack@400 In Stock
 EAR99 8541.10.0040  
CPL03-CMJD0300-CT Active Bare die,15.700 X 15.700 mils,CLD Series WafflePack@400 In Stock
 EAR99 8541.10.0040  
CPL03-CMJD0300-WN Active Bare die,15.700 X 15.700 mils,CLD Series Wafer@101,000*</br>*Estimated, die qty will vary based on probing Please call for Qty
 EAR99 8541.10.0040  
CPL03-CMJD0300-CT20 Special Order Item Bare die,15.700 X 15.700 mils,CLD Series WafflePack@20 In Stock
 EAR99 8541.10.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Wafer Transistor
Analytical Test Report:Wafer Schottky
Analytical Test Report:Wafer Switching Diode
Analytical Test Report:Die
Analytical Test Report:Die
Product Brief:PB CPL03-CMJD SER
Package Detail Document:WAFER
Analytical Test Report:Wafer Rectifier
Analytical Test Report:Wafer
Analytical Test Report:TVS Die
Analytical Test Report:Wafer/Die
Analytical Test Report:Die

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details &
Composition
Status
Availability

CMJD0300 		100V,.31mA Surface mount Diode-Current Limiting Single
Box, Reel
Active

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