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CMLSH05-4
500mA,40V Surface mount Diode-Schottky (<1A) Single: High Current: Low VF
The image for CMLSH05-4
is currently unavailable.

Please refer to the Device Datasheet for an image of the part case and material composition information.
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CPD94X-CMDSH05-4
Chip Process Datasheet:CPD96V-CMDSH05-4
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CMLSH05-4 BK Active 500mA,40V Surface mount Diode-Schottky (<1A) Single: High Current: Low VF Box@5,000 Please call for Qty
EAR99 8541.10.0070 C54 
Either
PBFREE
TIN/LEAD
CMLSH05-4 TR Active 500mA,40V Surface mount Diode-Schottky (<1A) Single: High Current: Low VF Reel@3,000 In Stock
EAR99 8541.10.0070 C54 
Either
PBFREE
TIN/LEAD
CPD94X-CMLSH05-4-CT Active 500mA,40V Bare die,20.000 X 20.000 mils,Diode-Schottky (<1A) WafflePack@400 In Stock
EAR99 8541.10.0040  
CPD94X-CMLSH05-4-WN Active 500mA,40V Bare die,20.000 X 20.000 mils,Diode-Schottky (<1A) Wafer@59,471*</br>*Estimated, die qty will vary based on probing Please call for Qty
EAR99 8541.10.0040  
CPD96V-CMLSH05-4-CT End Of Life 500mA,40V Bare die,20.079 X 20.079 mils,Diode-Schottky (<1A) WafflePack@400 Replaced by CPD94X-CMLSH05-4-CT
Exact Electrical Equivalent, Slight Mechanical Differences
EAR99 8541.10.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Gold Bond Wire
Analytical Test Report:Epoxy Molding Compound
Analytical Test Report:Leadframe
Analytical Test Report:Leadframe
Analytical Test Report:Sn Plating
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Copper Bond Wire
Spice Model:Spice Model CMLSH05-4
Material Composition:SOT-563
Process Change Notice:SOT-563 Alternate Lead Frame
Process Change Notice:Copper Wire Bonding - SOT-563

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details
&
Composition
Status
Availability

CMDSH05-4
500mA,40V Surface mount Diode-Schottky (<1A) Single: High Current: Low VF
Box, Reel
Active

CMPSH05-4
500mA,40V Surface mount Diode-Schottky (<1A) Single: High Current: Low VF
Box, Reel
Active

CMUSH05-4
500mA,40V Surface mount Diode-Schottky (<1A) Single: High Current: Low VF
Box, Reel
Active

CPD94X-CMLSH05-4
500mA,40V Bare die,20.000 X 20.000 mils,Diode-Schottky (<1A)
WaferForm, WafflePack
Active

CPD96V-CMLSH05-4
500mA,40V Bare die,20.079 X 20.079 mils,Diode-Schottky (<1A)
WaferForm, WafflePack
End Of Life, Stock Only<br><a href="https://my.centralsemi.com/search/search2.php?searchtext=CPD94X-CMLSH05-4">Replaced by:CPD94X-CMLSH05-4</a>

None

 

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