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manufacturer of innovative discrete semiconductor solutions
Central Semiconductor

CMPSH05-4
500mA,40V Surface mount Diode-Schottky (<1A) Single: High Current: Low VF
CMPSH05-4 product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CPD94X-CMDSH05-4
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CMPSH05-4 BK Active 500mA,40V Surface mount Diode-Schottky (<1A) Single: High Current: Low VF Box@3,500 Please call for Qty
 EAR99 8541.10.0070 C054 
Either
PBFREE
TIN/LEAD
CMPSH05-4 TR Active 500mA,40V Surface mount Diode-Schottky (<1A) Single: High Current: Low VF Reel@3,000 In Stock
 EAR99 8541.10.0070 C054 
Either
PBFREE
TIN/LEAD
CMPSH05-4 TR13 Active 500mA,40V Surface mount Diode-Schottky (<1A) Single: High Current: Low VF Reel@10,000 Please call for Qty
 EAR99 8541.10.0070 C054 
Either
PBFREE
TIN/LEAD
CPD94X-CMLSH05-4-CT Active 500mA,40V Bare die,20.000 X 20.000 mils,Diode-Schottky (<1A) WafflePack@400 In Stock
 EAR99 8541.10.0040  
CPD94X-CMLSH05-4-WN Active 500mA,40V Bare die,20.000 X 20.000 mils,Diode-Schottky (<1A) Wafer@59,471*</br>*Estimated, die qty will vary based on probing Please call for Qty
 EAR99 8541.10.0040  
CPD96V-CMLSH05-4-CT Discontinued 500mA,40V Bare die,20.079 X 20.079 mils,Diode-Schottky (<1A) WafflePack@400 Replaced by CPD94X-CMLSH05-4-CT
Exact Electrical Equivalent, Slight Mechanical Differences 		EAR99 8541.10.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Leadframe
Analytical Test Report:Gold Bond Wire
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Sn Plating
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Copper Bond Wire
Analytical Test Report:Henkel 84-1LMISR4
Spice Model:Spice Model CMPSH05-4
Material Composition:SOT-23
Process Change Notice:Copper Wire Bonding
Package Detail Document:SOT-23
Product Reliability Data:SOT-23 Package Reliability

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details &
Composition
Status
Availability

CMDSH05-4 		40V Surface mount Diode-Schottky (<1A) Single: High Current: Low VF
Box, Reel
Active

CMLSH05-4 		500mA,40V Surface mount Diode-Schottky (<1A) Single: High Current: Low VF
Box, Reel
Active

CMUSH05-4 		40V Surface mount Diode-Schottky (<1A) Single: High Current: Low VF
Box, Reel
Active

CPD94X-CMLSH05-4 		500mA,40V Bare die,20.000 X 20.000 mils,Diode-Schottky (<1A)
WaferForm, WafflePack
Active

CPD96V-CMLSH05-4 		500mA,40V Bare die,20.079 X 20.079 mils,Diode-Schottky (<1A)
WaferForm, WafflePack
Discontinued, Stock Only<br><a href="https://my.centralsemi.com/search/search2.php?searchtext=CPD94X-CMLSH05-4">Replaced by:CPD94X-CMLSH05-4</a>

None

 

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