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manufacturer of innovative discrete semiconductor solutions
Central Semiconductor

CMOD3003
200mA,200V Surface mount Diode-Low Leakage Single
CMOD3003 product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CPD66X-CMOD3003
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CMOD3003 BK Active 200mA,200V Surface mount Diode-Low Leakage Single Box@5,000 Please call for Qty
 EAR99 8541.10.0070 3C 
Either
PBFREE
TIN/LEAD
CMOD3003 TR Active 200mA,200V Surface mount Diode-Low Leakage Single Reel@3,000 In Stock
 EAR99 8541.10.0070 3C 
Either
PBFREE
TIN/LEAD
CPD66X-CMPD3003-CT Active 200mA,200V Bare die,17.500 X 17.500 mils,Diode-Low Leakage WafflePack@400 Please call for Qty
 EAR99 8541.10.0040  
CPD66X-CMPD3003-WN Active 200mA,200V Bare die,17.500 X 17.500 mils,Diode-Low Leakage Wafer@55,461*</br>*Estimated, die qty will vary based on probing Please call for Qty
 EAR99 8541.10.0040  
CPD64-CMPD3003-CT Discontinued 200mA,200V Bare die,17.500 X 17.500 mils,Diode-Low Leakage WafflePack@400 Replaced by CPD66X-CMPD3003-CT
Exact Electrical Equivalent, Slight Mechanical Differences 		EAR99 8541.10.0040  
CPD64-CMPD3003-WN Discontinued 200mA,200V Bare die,17.500 X 17.500 mils,Diode-Low Leakage Wafer@34,368*</br>*Estimated, die qty will vary based on probing Replaced by CPD66X-CMPD3003-WN
Exact Electrical Equivalent, Slight Mechanical Differences 		EAR99 8541.10.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Alloy 42 leadframe
Analytical Test Report:Sn Plating
Analytical Test Report:Gold Bond Wire
Analytical Test Report:Halogen Epoxy Molding Compound
Analytical Test Report:Leadframe
Analytical Test Report:Gold Bond Wire
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Sn Plating
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Copper Bond Wire
Analytical Test Report:Die
Spice Model:Spice Model CMOD3003
Material Composition:SOD-523
Process Change Notice:CPD64 REPLACED WITH CPD66X
Process Change Notice:Copper Wire Bonding - SOD-523
Process Change Notice:CPD66X DOPANT CHANGE
Package Detail Document:SOD-523
Product Reliability Data:SOD-523 Package Reliability

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details &
Composition
Status
Availability

CMDD3003 		200mA,200V Surface mount Diode-Low Leakage Single
Box, Reel
Active

CMPD3003 		200mA,200V Surface mount Diode-Low Leakage Single
Box, Reel
Active

CPD64-CMPD3003 		200mA,200V Bare die,17.500 X 17.500 mils,Diode-Low Leakage
WaferForm, WafflePack
Discontinued, Stock Only<br><a href="https://my.centralsemi.com/search/search2.php?searchtext=CPD66X-CMPD3003">Replaced by:CPD66X-CMPD3003</a>

None

 

CPD66X-CMPD3003 		200mA,200V Bare die,17.500 X 17.500 mils,Diode-Low Leakage
WaferForm, WafflePack
Active

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