You are logged in as ::  Guest      Registered user login
manufacturer of innovative discrete semiconductor solutions
Central Semiconductor

CPD66X-CMPD3003
200mA,200V Bare die,17.500 X 17.500 mils,Diode-Low Leakage
The image for CPD66X-CMPD3003
is currently unavailable.
Please refer to the Device Datasheet for an image of the part case and material composition information.
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CPD66X-CMPD3003-CT Active 200mA,200V Bare die,17.500 X 17.500 mils,Diode-Low Leakage WafflePack@400 Please call for Qty
 EAR99 8541.10.0040  
CPD66X-CMPD3003-WN Active 200mA,200V Bare die,17.500 X 17.500 mils,Diode-Low Leakage Wafer@55,461*</br>*Estimated, die qty will vary based on probing Please call for Qty
 EAR99 8541.10.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Wafer Transistor
Analytical Test Report:Wafer Schottky
Analytical Test Report:Wafer Switching Diode
Analytical Test Report:Wafer Zener
Analytical Test Report:Wafer Schottky
Analytical Test Report:Active Device, Rectifier
Analytical Test Report:Wafer/Die
Analytical Test Report:Die
Analytical Test Report:Die
Analytical Test Report:Die
Analytical Test Report:Die
Analytical Test Report:Die
Spice Model:Spice Model CPD66
Process Change Notice:CPD66X DOPANT CHANGE
Package Detail Document:WAFER
Analytical Test Report:Wafer Zener
Analytical Test Report:Wafer Rectifier
Analytical Test Report:Wafer MOSFET
Analytical Test Report:TVS Die
Analytical Test Report:Wafer/Die
Analytical Test Report:Die
Analytical Test Report:Die

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details &
Composition
Status
Availability

CMDD3003 		200mA,200V Surface mount Diode-Low Leakage Single
Box, Reel
Active

CMOD3003 		200mA,200V Surface mount Diode-Low Leakage Single
Box, Reel
Active

CMPD3003 		200mA,200V Surface mount Diode-Low Leakage Single
Box, Reel
Active

CPD64-CMPD3003 		200mA,200V Bare die,17.500 X 17.500 mils,Diode-Low Leakage
WaferForm, WafflePack
Discontinued, Stock Only<br><a href="https://my.centralsemi.com/search/search2.php?searchtext=CPD66X-CMPD3003">Replaced by:CPD66X-CMPD3003</a>

None

 

  In order to better serve you, we have created a new web based request system.
Click here to access our new inquiry page. Login to the website is required.
First time users please use the quick and easy one time website registration.

For further assistance using the new web based request system, click here.