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CMPFJ175
3V,6V,50mA,225mW Surface mount JFET P Channel
CMPFJ175 product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CP613V-J175
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CMPFJ175 BK Active 3V,6V,50mA,225mW Surface mount JFET P Channel Box@3,500 Please call for Qty
EAR99 8541.21.0080 6W 
Either
PBFREE
TIN/LEAD
CMPFJ175 TR Active 3V,6V,50mA,225mW Surface mount JFET P Channel Reel@3,000 In Stock
EAR99 8541.21.0080 6W 
Either
PBFREE
TIN/LEAD
CP613V-J175-WN Active Bare die,24.000 X 21.000 mils,JFET,P-Channel Amplifier JFET Wafer@29,700*</br>*Estimated, die qty will vary based on probing In Stock
EAR99 8541.21.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Leadframe
Analytical Test Report:Gold Bond Wire
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Sn Plating
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Copper Bond Wire
Product Brief:PB JFETs
Material Composition:SOT-23
Process Change Notice:Copper Wire Bonding
Process Change Notice:CP613V Replaces CP688
Package Detail Document:SOT-23
Product Reliability Data:SOT-23 Package Reliability
Step File 3D Object:SOT-23

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details
&
Composition
Status
Availability

CP613V-J175
Bare die,24.000 X 21.000 mils,JFET,P-Channel Amplifier JFET
WaferForm, WafflePack
Active

J175
Through-Hole JFET P Channel
Box
Discontinued, Stock Only

None

 

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