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manufacturer of innovative discrete semiconductor solutions

J175
Through-Hole JFET P Channel
The image for J175
is currently unavailable.

Please refer to the Device Datasheet for an image of the part case and material composition information.
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CP613V-J175
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CP613V-J175-WN Active Bare die,24.000 X 21.000 mils,JFET,P-Channel Amplifier JFET Wafer@29,700*</br>*Estimated, die qty will vary based on probing In Stock
EAR99 8541.21.0040  
J175 Discontinued , Stock Only Through-Hole JFET P Channel Box@2,500 None
EAR99 8541.21.0095
CEN 
J17 
Either
PBFREE
TIN/LEAD

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Halogen Free
Analytical Test Report:Pure Tin Solder, Sn
Analytical Test Report:Tin Plating
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Epoxy Adhesive
Material Composition:TO-92
Package Detail Document:TO-92
Product EOL Notice:TO-92 JFETS
Product Reliability Data:TO-92 Package Reliability

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details
&
Composition
Status
Availability

CMPFJ175
3V,6V,50mA,225mW Surface mount JFET P Channel
Box, Reel
Active

CP613V-J175
Bare die,24.000 X 21.000 mils,JFET,P-Channel Amplifier JFET
WaferForm, WafflePack
Active

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