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CP317-2N918
15V,50mA,200mW Bare die,14.565 X 14.565 mils,Transistor-Small Signal (<=1A)
The image for CP317-2N918
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Please refer to the Device Datasheet for an image of the part case and material composition information.
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CP317-2N918-CT Discontinued , Stock Only 15V,50mA,200mW Bare die,14.565 X 14.565 mils,Transistor-Small Signal (<=1A) WafflePack@400 None
EAR99 8541.21.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Wafer Transistor
Analytical Test Report:Wafer Schottky
Analytical Test Report:Wafer Switching Diode
Analytical Test Report:Wafer Zener
Analytical Test Report:Wafer Schottky
Analytical Test Report:Active Device, Rectifier
Analytical Test Report:Wafer/Die
Analytical Test Report:Die
Analytical Test Report:Die
Analytical Test Report:Die
Analytical Test Report:Die
Analytical Test Report:Die
Spice Model:Spice Model CP317
Process Change Notice:WAFER THICKNESS REDUCTION
Package Detail Document:WAFER
Product EOL Notice:BLANKET PDN-BARE DIE PRODUCTS

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